DAVID V. ZAWACKI
Medford, MA 02155
david@dzawacki.com

Electrical Engineering professional with extensive experience in all aspects of design, build, debug, training and support, as well as project management within global organizations.  A demonstrated ability to learn new concepts, easily adapt to change, mentor others, and speak fluent German.  A participative leadership style with excellent skills in cross-functional team building.


TECHNICAL SUMMARY

Hardware Design Tools: Cadence Concept HDL, Cadence SpectreS, Agilent ADS, Momentum RF, Polar Si9000, SPICE , Vector Network Analyzer, Spectrum Analyzer, Power Meter, Signal Generator

Methodologies: Schematic Capture, PCB Layout, EMI Reduction, FMEA, GPIB, .NET, COM, OOP, GUI, HMI, RTOS, ATE, RS232, ISO 9000, Six Sigma, Software Development Life Cycle

Programming Languages: C, C#, C++, Visual Basic, Java, Verilog HDL, Intel Assembly Language, National Instruments Lab Windows CVI

Software: Lotus Notes, Microsoft Office, Visio, Visual Studio 2005, MathCAD, MATLAB, Oracle, Rational ClearCase UCM, ClearQuest, SAP, Front Page, Tornado, Promis-e, AutoCAD

Platforms: Windows 2000 / XP / Vista, UNIX, IRIX, Solaris, Wind River VxWorks

Embedded Systems: Motorola PowerPC, Siemens S7, Epson Robots, Simodrive, Moog, DeltaTau PMAC, Profibus

Regulations: ISO 9000, FDA Regulations: QSR and 21 CFR Part 11


PROFESSIONAL EXPERIENCE

SKYWORKS SOLUTIONS, INC. - New Product Introduction - Woburn, MA                        2008 - Present
Innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity.
 
SENIOR RF TEST Engineer (2008)
Develop ATE RF solutions for GaAs based RFIC's (both discrete and integrated circuit designs). Test plan development for wafer level circuit testing and characterization. Perform bench level measurements, data correlation analysis, test solution debugging, test time reduction, and yield enhancement.


TERADYNE, INC. - New Product Introduction - North Reading, MA				2004 - 2008
Leading supplier of Automatic Test Equipment to the world's leading semiconductor, and electronics companies.

TEST DEVELOPMENT ENGINEER (2004 - 2008)
Developed mixed signal test strategies including the design and verification of instrument level diagnostics.  Designed system interfaces, software applications, and analog circuit boards which integrated performance verification capabilities into production with a focus on documentation, training, and process control.

  * Designed a 16 layer analog circuit board and a calibration fixture in order to perform a fully automated calibration and performance verification process for broadband test products
  * Reduced verification times by 96% by inventing a new corporate software application which automated the testing of RF hardware modules
  * Managed a cross-functional reliability team that reduced product failures at customer sites by 29%, and improved instrument MTBF through data collection, root cause analysis, and corrective action procedures
  * Earned a promotion to Test Development Engineer within the first 6 months of employment

TEST ENGINEER (2004)
Debugged and troubleshot to the component level complex analog, digital, and RF circuits.  Collaborated with design and test development engineers to resolve product and process issues.  Maintained in-house instruments, systems, and test fixtures.  Collected and analyzed SPC data to aid in problem resolutions.


SIEMENS / OSRAM SYLVANIA - Equipment Development - Danvers, MA				1998 - 2004
Worldwide leader in the design of automated manufacturing solutions that produce a wide range of consumer, industrial, and automotive lighting products in Germany, Canada, and the United States.

SENIOR ELECTRICAL DESIGN ENGINEER (1999 - 2004)
Conceived real-time embedded systems utilizing Motorola PowerPC, Siemens S7, and Epson Robots.  Developed machine vision applications for product inspection and closed loop motion control feedback.  Generated software to control multi-axis servo motor systems.  Created bills of materials, schematics, and process flow diagrams.

  * Achieved a $100,000 monthly cost savings resulting in a discretionary award for the on time delivery of a new 9006 automotive head lamp production line
  * Designed a fault tolerant RS-232 serial communications system which safely integrated three pieces of high speed automation equipment
  * Integrated a four-axis robotic transfer device with vision feedback between two independently running machines that manufacture the H13 double filament headlight
  * Developed an automated visual inspection system for accepting and rejecting glass flares based on their physical dimensions and geometry
  * Earned a promotion within the first year of employment by assuming an increased level of responsibility

ELECTRICAL ENGINEERING PROJECT LEADER (2001 - 2003)
Managed the design, debug, and installation of multimillion dollar production lines.  Purchased and integrated external machines from outside vendors.  Adapted German equipment to conform with NFPA requirements.  Prepared daily to-do lists, maintained project schedules, and executed training plans for global support teams.

  * Earned an "HID AC Equipment Exceptional Performance Award" from Osram's Global Automotive Lighting Division for the on time and under budget installation of the first Xenon head lamp production line in North America
  * Programmed a two-axis servo motor system that unloaded a three dimensional array of ceramic bases from a prepackaged cardboard box to an inline conveyor
  * Designed an automated basing machine capable of producing 16 different types of lamps with raw materials of various sizes and dimensions

GLOBAL EXCHANGE ENGINEER (2000 - 2001)
Worked and lived in Augsburg, Germany for 14 months as part of a paired engineering exchange program.  Served as a liaison between colleagues in Germany and the United States.  Programmed multiple machines using the German language for all operator interfaces and documentation.


EDUCATION & TRAINING

Credits toward MS Electrical Engineering (MSEE), TUFTS UNIVERSITY - Medford, MA		May 2009
  * GPA: 3.45, Courses: Microwave Devices, CAD of Microwave Circuits, Semiconductor Devices, MW Semiconductor Devices, Microwave Integrated Circuits, Silicon Radio Frequency IC Design, Computer Architecture
  * Projects: BJT Maximum Gain Amplifier Design, LNA FET Design, Negative Feedback BJT Amplifier Design, Microstrip Hybrid Coupler and Wilkinson Power Divider Design Simulation and Build using an LPKF Machine, Summit 9000 40GHz Microwave Probe Station Calibration and Wafer Test, SiGe HBT device characterization using MATLAB
  * Master's Project: Develop an automated test bench to characterize the HBT performance of SiGe wafers

BSEE, Cum Laude, WESTERN NEW ENGLAND COLLEGE - Springfield, MA				1998
  * GPA: 3.37, Dean’s List for six semesters, inducted into Tau Beta Pi and Sigma Beta Tau Honor Societies
  * Senior Design Project: Designed a broadband high-frequency amplifier using surface mount technology


INTERESTS

German language and culture, international travel, skiing, softball, sea kayaking, web design, computer repair, photography, and Red Cross first aid responder.